High-Performance Conductive Adhesives Unlock the Potential of GaN, SiC, and EV Modules (Video)

Power chips in EVs, RF chips in 5G base stations, and power devices in solar inverters all face the same problem: as power density climbs and components shrink, what bonds a chip to its metal substrate has to conduct current, pull heat away fast, and survive years of thermal cycling between -40°C and 200°C without cracking — this is the packaging-materials challenge ChemWhat focuses on. Traditional gold-tin solder and tin paste have limited thermal conductivity and demanding process temperatures, and with GaN and SiC chips they often can’t dissipate heat fast enough, causing throttling, burnout, or interface cracking under repeated thermal cycling. ChemWhat’s answer is a family of differently formulated conductive adhesives, silver pastes, and copper pastes matched to each application: a single-component epoxy silver adhesive for low-to-medium-power LEDs and consumer ICs, low-cure and warp-free; a modified-polyurethane LCM adhesive for displays, with minimal bleed-through and proven corrosion resistance. The harder problem is high-power devices — GaN RF chips, SiC power devices, EV IGBT modules — where heat flux overwhelms ordinary adhesives. ChemWhat’s pressureless and pressure-assisted silver sintering pastes solve this: resin-free, sintering into a dense silver layer with thermal conductivity above 260 W/m·K, curing as low as 160–200°C, with sub-3% porosity even on larger chips. In one RF project, switching to sintered silver from gold-tin solder cut thermal resistance 18% and junction temperature 10–15°C; shear strength reached 51.6 kg versus 31 kg for a competing sintered-silver product, with a harder, more continuous fracture mode. For EV drive systems and charging infrastructure, ChemWhat’s sintered copper paste enables an all-copper interconnect that avoids CTE-mismatch cracking, extends thermal-cycling life 3–5x, and costs less than silver at volume. A dedicated high-thermal-conductivity insulating adhesive covers sensors and MEMS needing both conduction and 10kV dielectric strength. Benchmarked against competitors and validated across real deployments, this portfolio makes ChemWhat a preferred supplier across consumer, automotive, telecom, and defense packaging applications.