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High-Performance Conductive Adhesives Unlock the Potential of GaN, SiC, and EV Modules (Video)

Power chips in EVs, RF chips in 5G base stations, and power devices in solar inverters all face the same problem: as power density climbs and components shrink, what bonds a chip to its metal substrate has to conduct current, pull heat away fast, and survive years of thermal cycling between -40°C and 200°C without cracking — this is the packaging-materials challenge ChemWhat focuses on. Traditional gold-tin solder and tin paste have limited thermal conductivity and demanding process temperatures, and with GaN and SiC chips they often can’t dissipate heat fast enough, causing throttling, burnout, or interface cracking under repeated thermal cycling. ChemWhat’s answer is a family of differently formulated conductive adhesives, silver pastes, and copper pastes matched to each application: a single-component epoxy silver adhesive for low-to-medium-power LEDs and consumer ICs, low-cure and warp-free; a modified-polyurethane LCM adhesive for displays, with minimal bleed-through an...
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High-Performance Conductive Adhesives Unlock the Potential of GaN, SiC, and EV Modules

I. Power Semiconductor Upgrades Drive Encapsulation Material Innovation With the rapid adoption of third-generation semiconductors (SiC, GaN), high-power IGBT modules, and automotive-grade power devices, operating current densities and junction temperatures of chips are continuously rising. Traditional tin-based solders (e.g., AuSn, SAC) are increasingly reaching their limits in terms of thermal conductivity, high-temperature reliability, and resistance to thermal fatigue. The industry broadly recognizes that: High-Voltage, High-Frequency, and High-Power Density Applications: (e.g., photovoltaic inverters, rail transit, smart grids, and new energy vehicle driving/charging systems) impose more stringent requirements for the thermal conductivity and junction temperature control of encapsulation materials. High Aspect Ratio Chips: (e.g., GaN RF devices with aspect ratios up to 5:1 or 6:1) are prone to new issues such as stress concentration and sintering delamination under ...
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How Advanced Conductive Adhesives Unlock Performance in GaN, SiC, and EV Modules

Power chips in EVs, RF chips in 5G base stations, and power devices in solar inverters all face the same problem: as power density climbs and components shrink, what bonds a chip to its metal substrate has to conduct current, pull heat away fast, and survive years of thermal cycling between -40°C and 200°C without cracking — this is the packaging-materials challenge ChemWhat focuses on. Traditional gold-tin solder and tin paste have limited thermal conductivity and demanding process temperatures, and with GaN and SiC chips they often can't dissipate heat fast enough, causing throttling, burnout, or interface cracking under repeated thermal cycling. ChemWhat's answer is a family of differently formulated conductive adhesives, silver pastes, and copper pastes matched to each application: a single-component epoxy silver adhesive for low-to-medium-power LEDs and consumer ICs, low-cure and warp-free; a modified-polyurethane LCM adhesive for displays, with minimal bleed-through and p...
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ChemWhat Conductive Circuit Pastes & Conductive Shielding Pastes: A Material Platform Built to Print, Stretch, and Shield (Video)

Smartphone antennas, automotive defrosting circuits on panoramic roofs, wearable ECG electrodes, and EMI shielding in telecom base stations all rely on the same category of material: conductive paste that prints, sprays, or molds like ink. This is where ChemWhat’s two product lines come in — conductive circuit pastes and conductive shielding pastes. On the circuit side, ChemWhat’s low-temperature silver paste cures at just 80–90°C, survives 5,000+ abrasion cycles, and holds 4B adhesion after 1,000+ hours of 85°C/85% RH aging. For FPC boards and touch sensors, screen printing reaches 60-micron lines, and laser etching pushes below 30 microns. A dedicated stretchable silver paste withstands 2,000+ cycles at 30% elongation, keeping wearable electrodes and roof-glass heating circuits intact under repeated flexing. The portfolio extends further — solderable low-temperature paste, low-temperature sintered antenna paste, nanoimprint and PEDOT:PSS transparent conductive ink for tran...
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Why Pure Isn't Enough: Decoding the Hidden Specs of Biochemicals

In the precise fields of biochemistry and analytical chemistry, researchers often encounter a confounding issue: when using the same compound—such as Phosphoenolpyruvate Monopotassium Salt (PEP-K, ChemWhat®38422) for metabolic research, Phosphoenolpyruvate Monocyclohexylammonium Salt (PEP-CHA, ChemWhat®38345) for studies, or Ferene Disodium Salt (Ferene, ChemWhat®25976) for precision metal ion detection—they find that despite the market being flooded with suppliers and labels displaying similar chemical purity, the performance of products from different manufacturers varies drastically. I. Purity is Not Omnipotent: The Neglected “Invisible Quality Boundary” Most suppliers define chemicals solely through the single dimension of “chemical purity.” However, for biochemical experiments, it is often the “non-standard metrics” beyond the label that determine success or failure . Differences in Impurity Profiles: During the synthesis of bio...
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