Power chips in EVs, RF chips in 5G base stations, and power devices in solar inverters all face the same problem: as power density climbs and components shrink, what bonds a chip to its metal substrate has to conduct current, pull heat away fast, and survive years of thermal cycling between -40°C and 200°C without cracking — this is the packaging-materials challenge ChemWhat focuses on. Traditional gold-tin solder and tin paste have limited thermal conductivity and demanding process temperatures, and with GaN and SiC chips they often can't dissipate heat fast enough, causing throttling, burnout, or interface cracking under repeated thermal cycling. ChemWhat's answer is a family of differently formulated conductive adhesives, silver pastes, and copper pastes matched to each application: a single-component epoxy silver adhesive for low-to-medium-power LEDs and consumer ICs, low-cure and warp-free; a modified-polyurethane LCM adhesive for displays, with minimal bleed-through and p...
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